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The low dielectric materials market is expected to grow from USD 1.60 billion in 2021 to USD 2.72 billion in 2029, at a CAGR of 7.1% during the forecast period 2022-2029: GreyViews

The low dielectric material market includes Huntsman Corporation, Arxada, SABIC, Asahi Kasei, Topas Advanced Polymers, Zeon Corp., Chemours Company LLC, DIC Corporation, Arkema, Mitsubishi Corporation, and others.In order to gain a significant market share and consolidate their position in the global low dielectric materials market, manufacturers are looking for expansion methods such as current developments, mergers and acquisitions, product innovations, collaborations as well as partnerships, joint ventures.Among them, Huntsman Corporation is one of the most important manufacturers and distributors in the global low dielectric materials market.
PUNE, India, July 14, 2022 (GLOBE NEWSWIRE) — The market has been studied for the following segmentation and regional analysis for North America, Europe, Asia, South America, Middle East and Africa.These are the key regions where the low dielectric materials market is currently operating and are expected to expand in the near future.Manufacturers and suppliers involved in the Low Dielectric Materials market are located in various countries in the above mentioned regions.
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The report provides a detailed understanding of the market segments formed by combining different outlooks by type, material type, application, etc.Apart from this, the following paragraphs also discuss the key drivers, restraints, potential growth opportunities and market challenges.
Important players operating in the global low dielectric materials market include Huntsman Corporation, Arxada, SABIC, Asahi Kasei, Topas Advanced Polymers, Zeon Corp., Chemours Company LLC, DIC Corporation, Arkema, Mitsubishi Corporation, and others.In order to gain a significant market share and consolidate their position in the global low dielectric materials market, manufacturers are looking for expansion methods such as current developments, mergers and acquisitions, product innovations, collaborations as well as partnerships, joint ventures.Among them, Huntsman Corporation is one of the most important manufacturers and distributors in the global low dielectric materials market.
A low dielectric material is a material that has a smaller dielectric constant compared to silicon dioxide.These materials are often referred to as a less conductive class of insulating materials.It facilitates the expansion of microelectronic devices.The low dielectric constant of a material indicates that it is a good insulator and a significantly poor conductor of electricity, sound or heat.
On the other hand, the advent of 5G communication technology presents many challenges for OEM manufacturers of electronic components in transmitting high-frequency signals using high-performance materials.The need for materials with low dielectric constant or excellent dielectric properties is emerging to ensure 5G communications.The material also helps mitigate signal loss in a range of electronic components and applications.This creates a huge demand for low-dielectric materials for printed circuit boards (PCBs), flexible printed circuits (FPCs), smart devices, wire and cable, and base station antennas.
Huntsman Corporation、Arxada、SABIC、Asahi Kasei、Topas Advanced Polymers、Zeon Corp.、Chemours Company LLC、DIC Corporation、Arkema 和 Mitsubishi Corporation 等
Types include thermoplastics, thermosets, and ceramics.The thermoset segment is expected to witness the highest growth rate over the forecast period.This type of dielectric material can be easily formed into stable shapes and has enhanced resistance to deformation during heating.In addition, thermosets have become prominent low-k materials in printed wiring board (PWB) fabrication due to their comparable strength, electrical resistance, and toughness.
The material type section includes fluoropolymers, modified polyphenylene oxides, polyimides, cyclic olefin copolymers, cyanate esters, liquid crystal polymers, and the like.The modified polyphenylene ether (M-PPE) segment is expected to register the highest CAGR during the forecast period.It is a hybrid resin composed of polystyrene and polyphenylene ether.This material is tough, has better temperature resistance and moderate mechanical properties.The above features contribute to the increased use of M-PPE dielectric materials in TV cabinets, motor end caps, PC components, pump housings, busbar insulators and lighting fixtures.
Applications include PCB, antenna, microelectronics, wire and cable, radome, etc.The radome segment is expected to witness the highest growth rate over the forecast period.A radome is a cover designed to protect an antenna system from the environment.Such systems use low dielectric materials to ensure reduced reflections and deleterious effects on electromagnetic signals.Therefore, the need for improved transmission efficiency for radome antenna systems is primarily driving the need for low dielectric materials.
Regional Analysis
Regional analysis provides detailed insights into key regions and countries.Some of the key countries analyzing low dielectric materials include the United States, Canada, Mexico, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, Brazil, Peru, United Arab Emirates, South Africa, and Saudi Arabia.
Asia Pacific has a large share.Growth in the region is mainly driven by falling prices of electronic components and increasing consumer demand for personal computing devices.However, Europe is expected to witness impressive growth rates over the forecast period.Growing demand for PCBs in the European automotive industry and rapid development of consumer electronics devices in the region drive the growth of the European market
The German low dielectric materials market size was valued at USD 180 million in 2021 and is expected to reach USD 300 million by 2029, growing at a CAGR of 7.0% from 2022 to 2029.In Europe, Germany is the largest market shareholder of low dielectric materials in the dielectric materials market.Also, the country is one of the leading countries in semiconductor production.This factor has been a major contributor to the German low dielectric materials market.In addition, in July 2020, Polytronics Technology Corp., a global manufacturer of thermal management products and thermally conductive plates, signed an agreement with Germany’s Henkel AG & Co. KGaA.Multinational chemical and consumer products company acquires Henkel’s Thermal Laminated Dielectric Materials (TCLAD) business unit.Such strategies adopted by global market players to expand their presence in the country further fuel the growth of the market.
The low dielectric materials market size in China was valued at USD 350 million in 2021 and is expected to reach USD 590 million by 2029, growing at a CAGR of 6.9% from 2022 to 2029.Over the past few years, China has become more self-sufficient in semiconductors due to the development of government funding and policies aimed at developing the sector.For example, in August 2020, the State Council of China announced policies to promote the high-quality development of the integrated circuit industry.Under these policies, the China Integrated Circuit Investment Industry Fund (CICIIF) is expected to bring in about $150 billion in state funds to support the domestic semiconductor industry.Such investments create lucrative growth opportunities for China’s low-dielectric materials market.
The low dielectric materials market size in India was valued at USD 110 million in 2021 and is expected to reach USD 190 million by 2029, growing at a CAGR of 7.3% from 2022 to 2029.India is one of the fastest growing economies in Asia.Rising investments in digitization in India along with the booming demand for consumer electronics are driving the growth of the low dielectric materials market.Furthermore, India has become an important investment hub for global PCB manufacturers.This factor further creates growth opportunities for the low dielectric materials market.For example, recently, Taiwan-based foundry Wistron Corporation announced that it would relocate its PCB manufacturing plant from China to Bangalore, India, with an investment of about $1 billion.
Covid-19 Impact
Covid-19 has had a major impact on almost every industry including electronics, semiconductors, manufacturing and automotive.Demand for low-dielectric materials declined during this period due to regulations on social distancing and supply chain disruptions.Manufacturing facilities for low-k materials were closed in the second and third quarters of fiscal 2020 in most regions.Key end users were also temporarily shut down during this period, so demand for low-dielectric materials dropped significantly.
Additionally, the global semiconductor industry has been facing severe shortages of raw materials due to supply chain disruptions caused by the COVID-19 pandemic.
Global Low Dielectric Materials Market Size by Type (Thermoplastics, Thermosets & Ceramics), Material Type (Fluoropolymers, Modified Polyphenylene Ethers, Polyimides, Cyclic Olefin Copolymers, Cyanate Ester, Liquid Crystal Polymers etc.), Application (PCB, Antenna, Microelectronics, Wire & Cable, Radome & Others), Region, Segment and Forecast to 2029.
Global Ceiling Market Size by Material Type (Mineral Fiber, Metal, Gypsum, etc.), Attribute Type (Acoustic and Non-Acoustic), End-User (Non-Residential and Residential), Region, Segment and Forecast to 2029.
Global biocomposites market size by fiber type (wood fiber composites and non-wood fiber composites), polymer type (natural polymer composites and synthetic polymer composites), product (hybrid biocomposites and green biocomposites) ), end-use industries (building and construction, transportation, consumer goods and others), regions, segments and forecasts to 2029.
Global Flat Glass Market Size by Product Type (Basic Float Glass, Tempered Glass, Coated Glass, Laminated Glass, Ultra Clear Glass, etc.), Technology (Float, Rolled & Sheet), End-Use Industry (Construction & Infrastructure, Automotive and Transportation, Solar, etc.), Regions, Segments and Forecasts to 2029.
Global Prepreg Market Size by Fiber Reinforcement Type (Carbon Fiber Prepreg, Glass Fiber Prepreg, etc.), Resin Type (Thermoset Prepreg and Thermoplastic Prepreg), Form (Tow Prepreg and Fabric Prepreg) ), Manufacturing Process (Hot Melt Process and Solvent Impregnation Process), Application (Aerospace & Defense, Wind Energy, Automotive, Sporting Goods, Electronics (PCB), etc.), Region, Segment and Forecast to 2029.
Global Acrylic Polymers Market Size by Type (Water-Based & Solvent-Based), Application (Laundry & Detergents, Dishwashing, Industrial & Institutional, Hard Surface Cleaning and Others), Region, Segmentation and Forecast to 2029.
Global Liquid Crystal Polymers Market Size By Type (Lyotropic & Thermotropic), By Application (Composites, Coatings, Motor Components, High Intensity LEDs, Electronic Components, Additives, etc.), By End-Use Industry (Electronics & Electrical, Automotive & Transportation) , Industrial Machinery, Aerospace & Defense, Healthcare, Consumer Goods & Others), Distribution Channel (Online & Offline) Region, Segmentation and Forecast to 2028.
By Product Type (Reusable & Disposable), Raw Materials (Neoprene, Nitrile, Natural Rubber/Latex, Vinyl, etc.), End User (Manufacturing, Construction, Chemical, Food, Oil & Gas, Mining, Transportation , Healthcare, Pharmaceutical and Others), Distribution Channel (Online & Offline) Region, Segmentation and Forecast to 2028
Global epoxy composites market size by manufacturing technology (compression molding, lamination, filament winding, resin injection, resin transfer molding, pultrusion, etc.), fiber type (carbon, glass, etc.), application (electronics and electrical, marine, Automotive & Transportation, Wind Energy, Aerospace & Defense, Sports & Consumer Goods, Construction, etc.), Distribution Channel (Online & Offline) Region, Segmentation and Forecast to 2028
Global Ceramic and Natural Stone Tile Market Size by Product Type (Porcelain, Granite, Travertine, Glazed Tile, Non-Scratch Tile, Limestone, etc.), Tile Type (Wall & Floor Tiles), Application (Commercial, Residential & Recreational), Distribution Channels (Online and Offline) Regions, Segmentation and Forecast to 2028
By Type (meta-aramid, para-aramid and copolyamide), Application (friction material, industrial filtration, safety and protection, rubber reinforcement, optical fiber, tire reinforcement, electrical insulation, etc.), end user (aerospace, automotive, Electronics & Telecommunications, Industrial & Others), Distribution Channels (Online & Offline) Region, Segmentation and Forecast to 2028.
Global Vinyl Flooring Market Size By Product (Luxury Vinyl Tiles & Vinyl Sheets & Vinyl Composite Tiles), By End User (Residential, Healthcare, Hospitality, Retail, Education, Sports, Office, Industrial & Automotive), By Region, By Segment Scores and forecasts for 2028.
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Post time: Jul-19-2022